Double-layer PCB is a commonly used PCB specification in the electronics industry. In addition to the double-layer board, there are more layers of PCB boards, for example, 4 layers, 8 layers, 12 layers, etc. Depending on the structure, the multi-layer board will be needed when the single or double layer could not be satisfied due concentrated circuit structure. Thus the design skills will be different.

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PCBs can be made in multi-layers. For multi-functional, small-volume electronic products, multi-layer PCBs are recommended. The most common multi-layer PCBs are four-layer and six-layer boards. Multi-layer boards are usually made firstly with inner layer graphics, then It is made into one-sided or double-panel by etching. It is then incorporated into the specified layer, and then combined by heating and pressing. The subsequent method is the same as that of the two-layer boards. As the electronic equipment becomes more and more complicated, the use of the multi-layer board is also more extensive.

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The main constituent material is a flexible copper clad laminate (FCCL), which can be divided into a non-adhesive flex board substrate (2 Layer FCCL) and an adhesive flex board substrate (3 Layer FCCL) depending on the number of layers. The biggest difference between the two is the adhesive between copper foil and the polyimide films. The 2L FCCL has the advantages of high heat resistance, good flex resistance, and good dimensional stability.

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Lightweight and small is the biggest feature of flex-rigid board. It can be bent to form 3D structure. Because of its good reliability, signal integrity, noise suppression and impedance control, it is often used in smart phone boards and photovoltaic panels, CMOS, battery modules, wearable devices and high-end storage devices. Because of the combination of HDI technology and high-speed signal development trends, the use of flex-rigid boards will be more extensive.

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MCPCB is a metal-based copper clad laminate with the ability to dissipate heat rapidly. Generally, the single layer is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. It can also be designed as a double-layer for high-end use. The structure is a circuit layer, an insulation layer, an aluminum base, an insulation layer and a circuit layer, respectively. A very small number of applications are multi-layer boards, which can be made of ordinary multi-layer boards combined with an insulating layer and an aluminum base. The LED aluminum substrate is PCB but the material of the circuit board is aluminum alloy. In the past, the material of our general circuit board was glass fiber, but because the LED generates high heat, the circuit board for LED lamps is generally aluminum substrate. It can conduct heat quickly. While the circuit board for other equipment or electrical appliances is still a fiberglass board.

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Since the process of manufacturing HDI boards is carried out in a “Build Up” manner, the technical difficulty has become large when the demand of HDI boards has gradually increased from the 2 layers to 8 layers. As long as the manufacturer's technical ability can be upgraded to more than 8 layers, it can bring competitive advantages to products with excellent value for money.In addition to the technical difficulty, larger capital expenditures are another challenge for PCB manufacturers to enter HDI.

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